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S71WS256NC0BFWAP0 Технические параметры

Spansion  S71WS256NC0BFWAP0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Specialized
Марка
Surface Mount YES
Number of Terminals 84Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SPANSION INC
Part Package Code BGA
Package Description 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84
Access Time-Max 80 ns
Moisture Sensitivity Levels 3
Number of Words 16777216 wordsWord
Number of Words Code 16000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e1
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE
Свойство продукта Значение свойства
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 84
JESD-30 Code R-PBGA-B84
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.054 mA
Organization 16MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.00007 A
Memory Density 268435456 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+PSRAM
Length 11.6 mm
Width 8 mm
Просмотр сходства
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