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HBM03DSEN Технические параметры
Sullins Connector Solutions HBM03DSEN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 3 Weeks | |
| Mount | Free Hanging | |
| Mounting Type | Free Hanging (In-Line) | |
| Material - Insulation | Polybutylene Terephthalate (PBT) | |
| Contact Materials | Beryllium Copper | |
| Operating Temperature | -65°C~125°C | |
| Packaging | Tray | |
| Published | 2015 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | Not Applicable | |
| Termination | Solder Eyelet(s) | |
| Connector Type | Full Bellows | |
| Number of Positions | 6Positions | |
| Color | Blue |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | Full Bellows | |
| Pitch | 0.156 3.96mm | |
| Total Number of Contacts | 6Contacts | |
| Contact Finish | Gold | |
| Reliability | COMMERCIAL | |
| Rated Current (Signal) | 3A | |
| Card Type | Non Specified - Dual Edge | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | 3Positions/Bay/Rows | |
| Contact Finish Thickness | 10.0μin 0.25μm | |
| Plating Thickness | 10μin | |
| Card Thickness | 0.062 1.57mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
HBM03DSEN Документы
- DatasheetsEdgecards .156 in Datasheet
- Environmental InformationSullins RoHS3
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