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HMC25DRAI Технические параметры

Sullins Connector Solutions  HMC25DRAI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Card Edge Connectors - Edgeboard Connectors
Марка
Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Through Hole, Right Angle
Material - Insulation Polybutylene Terephthalate (PBT)
Contact Materials Beryllium Copper
Operating Temperature -65°C~125°C
Packaging Tube
Published 2015
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Full Bellows
Number of Positions 50Positions
Color Blue
Number of Rows 2Rows
Gender Female
Additional Feature NONE
HTS Code 8536.69.40.40
Contact Type Full Bellows
Свойство продукта Значение свойства
Pitch 0.100 2.54mm
Total Number of Contacts 50Contacts
Number of Conductors ONEConductor
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 3.375 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Breadth 0.33 inch
Body Depth 0.637 inch
Rated Current (Signal) 3A
Contact Resistance 10mOhm
Card Type Non Specified - Dual Edge
Read Out Dual
Number of Positions/Bay/Row 25Positions/Bay/Rows
Flange Feature Top Mount Opening, Threaded Insert, 4-40
Body/Shell Style RECEPTACLE
Dielectric Withstanding Voltage 600VDC V
Insertion Force-Max 4.448 N
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 30μin
Card Thickness 0.062 1.57mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free

HMC25DRAI Документы

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