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HMC65DTEF Технические параметры
Sullins Connector Solutions HMC65DTEF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Gold | |
| Mount | Panel | |
| Mounting Type | Panel Mount | |
| Material - Insulation | Polybutylene Terephthalate (PBT) | |
| Contact Materials | Beryllium Copper | |
| Operating Temperature | -65°C~125°C | |
| Packaging | Tube | |
| Published | 2016 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | Not Applicable | |
| Termination | Solder Eyelet(s) | |
| Connector Type | Full Bellows | |
| Number of Positions | 130Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | -65°C | |
| Color | Blue | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Contact Type | Full Bellows | |
| Pitch | 0.100 2.54mm | |
| Contact Finish | Gold | |
| Card Type | Non Specified - Dual Edge | |
| Read Out | Dual | |
| Number of Positions/Bay/Row | 65Positions/Bay/Rows | |
| Flange Feature | Top Mount Opening, Floating Bobbin, 0.116 (2.95mm) Dia | |
| Contact Finish Thickness | 30.0μin 0.76μm | |
| Card Thickness | 0.062 1.57mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
HMC65DTEF Документы
- Datasheets.100” [2.54 mm] Datasheet
- Environmental InformationSullins RoHS3
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