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HSM24DRKN Технические параметры

Sullins Connector Solutions  HSM24DRKN technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Card Edge Connectors - Edgeboard Connectors
Марка
Factory Lead Time 3 Weeks
Mount Through Hole
Mounting Type Through Hole
Material - Insulation Polybutylene Terephthalate (PBT)
Contact Materials Beryllium Copper
Operating Temperature -65°C~125°C
Packaging Tray
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
ECCN Code EAR99
Connector Type Full Bellows
Number of Positions 48Positions
Color Blue
Number of Rows 2Rows
Gender Female
HTS Code 8536.69.40.40
Contact Type Full Bellows
Pitch 0.156 3.96mm
Total Number of Contacts 48Contacts
Свойство продукта Значение свойства
Number of Conductors ONEConductor
Reference Standard UL, CSA
Contact Finish Gold
Reliability COMMERCIAL
Body Length or Diameter 4.683 inch
Number Of PCB Rows 2
PCB Contact Pattern RECTANGULAR
Body Depth 0.431 inch
Rated Current (Signal) 3A
Contact Resistance 30mOhm
Card Type Non Specified - Dual Edge
Read Out Dual
Insulation Resistance 5000000000Ohm
Number of Positions/Bay/Row 24Positions/Bay/Rows
Body/Shell Style RECEPTACLE
Dielectric Withstanding Voltage 1800VDC V
PCB Contact Row Spacing 3.556 mm
Withdrawl Force-Min .139 N
Mating Contact Row Spacing 0.156 inch
Contact Finish Thickness 10.0μin 0.25μm
Plating Thickness 10μin
Card Thickness 0.062 1.57mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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HSM24DRKN Документы

HSM24DRKN brand manufacturers: Sullins Connector Solutions, Anli stock, HSM24DRKN reference price.Sullins Connector Solutions. HSM24DRKN parameters, HSM24DRKN Datasheet PDF and pin diagram description download.You can use the HSM24DRKN Card Edge Connectors - Edgeboard Connectors, DSP Datesheet PDF, find HSM24DRKN pin diagram and circuit diagram and usage method of function,HSM24DRKN electronics tutorials.You can download from the Anli.