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1932031-1 Технические параметры
TE Connectivity 1932031-1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Connectors - Inline Module Sockets | |
| Марка | TE Connectivity | |
| Contact Plating | Gold Over Nickel | |
| Housing Material | Nylon | |
| Body Orientation | Straight | |
| Termination Method | Solder | |
| Base/Housing Material | Nylon | |
| Contact Materials | Copper Alloy | |
| Mounting | Through Hole | |
| Number of Contact Rows | 2Contact Rows | |
| Row Spacing (mm) | 1.9(mm) | |
| Product Depth (mm) | 7.54(mm) | |
| Mounting Styles | Through Hole | |
| Grid Size | Not Required |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Rad Hardened | No | |
| Pitch (mm) | 2(mm) | |
| Insulation Materials | Nylon | |
| Packaging | Tray | |
| Type | DDR3 SO DIMM | |
| Number of Rows | 2Rows | |
| Gender | SKT | |
| Pitch | 2.0000 mm | |
| Current Rating | 1.5/Contact(A) | |
| Number of Contacts | 240 POSContact | |
| Row Spacing | 1.9 mm | |
| Product Length | 141 mm | |
| Product Length (mm) | 141(mm) | |
| Product Height (mm) | 23.1(mm) |
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