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TE Connectivity 2057737-3 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Backplane Connectors - DIN 41612 | |
| Марка | TE Connectivity | |
| Factory Lead Time | 6 Weeks, 3 Days | |
| Lifecycle Status | Production (Last Updated: 3 days ago) | |
| Contact Plating | Gold | |
| Mount | Through Hole | |
| Housing Material | Polymer | |
| PCB Mounting Orientation | Vertical | |
| Underplate Material | Nickel | |
| Manufacturer Part Number | 2057737-3 | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TE CONNECTIVITY LTD | |
| Risk Rank | 5.75 | |
| Contact Finish Mating | NOT SPECIFIED | |
| Contact Materials | NOT SPECIFIED | |
| Manufacturer Series | 2057737 | |
| Body Orientation | Straight | |
| Termination Method | Press Fit | |
| Base/Housing Material | LCP (Liquid Crystal Polymer) | |
| Mounting | Through Hole | |
| Circuit Applications | Signal | |
| Voltage, Rating | 120 V | |
| Tail Length | 1.4 mm | |
| RoHS | Compliant | |
| Shrouded | Partially Shrouded | |
| Maximum Operating Temperature | + 85 C | |
| Minimum Operating Temperature | - 55 C | |
| Factory Pack QuantityFactory Pack Quantity | 13 | |
| Brand | TE Connectivity | |
| Operating Temperature | -55 to 85 °C | |
| Series | IMPACT Backplane | |
| Termination | Press-Fit | |
| Connector Type | BOARD CONNECTOR | |
| Type | High Density | |
| Number of Positions | 96Positions | |
| Max Operating Temperature | 185 °C | |
| Min Operating Temperature | -67 °C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Rows | 6Rows | |
| Gender | Header | |
| Subcategory | Backplane Connectors | |
| Pitch | 1.9000 mm | |
| Orientation | Vertical | |
| Reach Compliance Code | compliant | |
| Current Rating | 750 mA | |
| Pin Count | 96 | |
| Number of Contacts | 64Signal/32Ground POSContact | |
| Housing Color | Black | |
| Operating Supply Voltage | 30 V | |
| Row Spacing | 1.3462 mm | |
| ELV | Compliant | |
| Max Current Rating | 750 mA | |
| Sealable | No | |
| Contact Current Rating | 750 mA | |
| Data Rate | 25 Gbps | |
| Number of Signal Positions | 64Signal Positions | |
| Product Type | High Speed / Modular Connectors | |
| Hole Diameter | 381 µm | |
| Number of Columns | 16Columns | |
| Mating Alignment | With | |
| Stackable | No | |
| Make First / Break Last | No | |
| Differential Signaling | Yes | |
| Number of Pairs | 32Pairs | |
| Differential Pairs per Column | 2 | |
| Mounting Angle | Vertical | |
| Number of Ground Positions | 32Ground Positions | |
| Product Category | High Speed / Modular Connectors | |
| Product Length | 36.9 mm | |
| Width | 12.7 mm | |
| Height | 11.95 mm | |
| Length | 36.90112 mm | |
| Plating Thickness | 760 nm | |
| PCB Thickness | 990.6 µm | |
| Flammability Rating | UL94 V-0 |