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2110110-1 Технические параметры
TE Connectivity 2110110-1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Box Accessories | |
| Марка | TE Connectivity | |
| Contact Plating | Gold | |
| Material | Aluminum Nitride | |
| Housing Material | Liquid Crystal Polymer (LCP) | |
| Shape | Rectangular | |
| Package | Tape & Reel (TR) | |
| Base Product Number | QB2010 | |
| Mfr | American Technical Ceramics | |
| Product Status | Active | |
| Voltage, Rating | 30 V | |
| Maximum Operating Temperature | + 85 C | |
| Minimum Operating Temperature | - 55 C | |
| Factory Pack QuantityFactory Pack Quantity | 16 | |
| Contact Materials | Copper Alloy | |
| Manufacturer | TE Connectivity | |
| Brand | TE Connectivity | |
| RoHS | Details | |
| Series | Q-Bridge | |
| Packaging | Tube | |
| Type | Thermal Bridge Jumper | |
| Number of Positions | 180 PositionPosition |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | - | |
| Number of Rows | 15 RowRow | |
| Subcategory | Backplane Connectors | |
| Pitch | 1.9 mm | |
| Current Rating | 750 mA | |
| Termination Style | Press Fit | |
| Housing Color | Black | |
| Accessory Type | - | |
| Usage | Heat Transfer | |
| Shelf Life | - | |
| Adhesive | - | |
| Storage/Refrigeration Temperature | - | |
| Product Type | High Speed / Modular Connectors | |
| Shelf Life Start | - | |
| Backing, Carrier | - | |
| Outline | 4.95mm x 2.41mm | |
| Thermal Conductivity | 100W/m-K, 159W/m-K | |
| Product | Receptacles | |
| Mounting Angle | Right Angle | |
| Thermal Resistivity | 6°C/W, 10°C/W | |
| Product Category | High Speed / Modular Connectors | |
| Thickness | 0.0598 (1.520mm) |
Индекс :
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