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TE Connectivity 2-2013297-1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Connectors - Inline Module Sockets | |
| Марка | TE Connectivity | |
| Lifecycle Status | Production (Last Updated: 6 days ago) | |
| Contact Plating | Gold Over Nickel | |
| Mount | Surface Mount | |
| Housing Material | Thermoplastic | |
| Body Orientation | Right Angle | |
| Voltage, Rating | 1.5V | |
| Number of Contact Rows | 2Contact Rows | |
| Row Spacing (mm) | 8.2(mm) | |
| Product Depth (mm) | 26.5(mm) | |
| Operating Temp Range | -55C to 85C | |
| Termination Method | Solder | |
| Mounting Styles | Surface Mount | |
| Contact Materials | Copper Alloy | |
| Grid Size | Not Required | |
| Rad Hardened | No | |
| Pitch (mm) | 0.6(mm) | |
| Insulation Materials | Thermoplastic | |
| Circuit Applications | Power | |
| Manufacturer Lifecycle Status | ACTIVE (Last Updated: 6 days ago) | |
| RoHS | Compliant | |
| Memory Types | DDR, SDRAM | |
| Packaging | Tape and Reel | |
| Termination | SMD/SMT |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Type | DDR3 SO DIMM | |
| Number of Positions | 204Positions | |
| Max Operating Temperature | 185 °C | |
| Min Operating Temperature | -67 °C | |
| Number of Rows | 2Rows | |
| Gender | SKT | |
| Pitch | 609.6 µm | |
| Orientation | Right Angle | |
| Depth | 26.5 mm | |
| Current Rating | 0.5/Contact(A) | |
| Number of Contacts | 204(POS)Contact | |
| Housing Color | Black | |
| Row Spacing | 8.1788 mm | |
| ELV | Compliant | |
| Max Current Rating | 500 mA | |
| Sealable | No | |
| Contact Current Rating | 500 mA | |
| Product Length (mm) | 75.9(mm) | |
| Height | 8 mm | |
| Length | 75.9 mm | |
| Stack Height | 8.001 mm | |
| Product Height (mm) | 8.23(mm) | |
| Radiation Hardening | No | |
| Flammability Rating | UL94 V-0 |