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DS90LV027ATM Технические параметры
Texas Instruments DS90LV027ATM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Interface - Drivers, Receivers, Transceivers | |
| Марка | Texas Instruments | |
| Lifecycle Status | NRND (Last Updated: 3 days ago) | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Number of Pins | 8Pins | |
| Interface Standards | EIA-644; TIA-644 | |
| Number of Elements | 2 Elements | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tube | |
| JESD-609 Code | e0 | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Type | Driver | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Max Power Dissipation | 1.19W | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 235 | |
| Number of Functions | 2Functions | |
| Supply Voltage | 3.3V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Base Part Number | DS90LV027 | |
| Pin Count | 8 | |
| Operating Supply Voltage | 3.3V | |
| Power Dissipation | 1.19W | |
| Propagation Delay | 1.5 ns | |
| Turn On Delay Time | 1.5 ns | |
| Data Rate | 600Mbps | |
| Output Characteristics | DIFFERENTIAL | |
| Differential Output | Yes | |
| Output Polarity | COMPLEMENTARY | |
| Protocol | LVDS | |
| Input Characteristics | STANDARD | |
| Power Consumption | 27W | |
| Number of Drivers/Receivers | 2/0Drivers/Receiver | |
| Driver Number of Bits | 2Bits | |
| Supply Voltage1-Nom | 3.3V | |
| High Level Input Current-Max | 0.00001A | |
| Height | 1.75mm | |
| Length | 4.9mm | |
| Width | 3.91mm | |
| Thickness | 1.58mm | |
| Radiation Hardening | No | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
DS90LV027ATM Документы
- PCN Design/SpecificationSOIC Pkg Wire Bonding 20/Mar/2013
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