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LM4808MX/NOPB Технические параметры
Texas Instruments LM4808MX/NOPB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Linear - Amplifiers - Audio | |
| Марка | Texas Instruments | |
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Number of Pins | 8Pins | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tape & Reel (TR) | |
| Series | Boomer® | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Type | Class AB | |
| Terminal Finish | Matte Tin (Sn) | |
| Max Power Dissipation | 6mW | |
| Voltage - Supply | 2V~5.5V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Base Part Number | LM4808 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Pin Count | 8 | |
| Output Type | Headphones, 2-Channel (Stereo) | |
| Supply Voltage-Max (Vsup) | 5.5V | |
| Supply Voltage-Min (Vsup) | 2V | |
| Number of Channels | 2Channels | |
| Nominal Supply Current | 3mA | |
| Power Dissipation | 16.5mW | |
| Output Power | 105mW | |
| Supply Type | Single | |
| Input Offset Voltage (Vos) | 50mV | |
| Bandwidth | 20 kHz | |
| Gain Bandwidth Product | 5.5MHz | |
| Voltage Gain | 67dB | |
| Power Supply Rejection Ratio (PSRR) | 89dB | |
| Max Output Power | 150mW | |
| Input Bias Current | 10pA | |
| Max Output Power x Channels @ Load | 150mW x 2 @ 16 Ω | |
| Features | Depop | |
| Height | 1.75mm | |
| Length | 4.9mm | |
| Width | 3.91mm | |
| Thickness | 1.58mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
LM4808MX/NOPB Документы
- PCN Design/SpecificationSOIC Pkg Wire Bonding 20/Mar/2013 Mold Compound 24/Mar/2016
Индекс :
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