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LM75BIM-5/NOPB Технические параметры
Texas Instruments LM75BIM-5/NOPB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Temperature Sensors - Analog and Digital Output | |
| Марка | Texas Instruments | |
| Lifecycle Status | ACTIVE (Last Updated: 3 days ago) | |
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
| Number of Pins | 8Pins | |
| Test Conditions | -25°C ~ 100°C (-55°C ~ 125°C) | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Tube | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| Terminal Finish | Matte Tin (Sn) | |
| Voltage - Supply | 3V~5.5V | |
| Base Part Number | LM75 | |
| Output Type | I2C | |
| Power Supplies | 5V | |
| Interface | 2-Wire, I2C, SMBus | |
| Termination Type | SOLDER |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Operating Supply Current | 280μA | |
| Nominal Supply Current | 280μA | |
| Output Current | 10μA | |
| Number of Bits | 9Bits | |
| Quiescent Current | 500μA | |
| Resolution | 8 b | |
| Sensor Type | Digital, Local | |
| Sensors/Transducers Type | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | |
| Max Supply Voltage (DC) | 5.5V | |
| Min Supply Voltage (DC) | 3V | |
| Housing | PLASTIC | |
| Accuracy - Highest (Lowest) | ±2°C (±3°C) | |
| Sensing Temperature - Local | -55°C~125°C | |
| Accuracy-Max | 3 Cel | |
| Features | Output Switch, Programmable Limit, Shutdown Mode | |
| Height | 1.75mm | |
| Length | 4.9mm | |
| Width | 3.91mm | |
| Thickness | 1.58mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
LM75BIM-5/NOPB Документы
- PCN Design/SpecificationSOIC Pkg Wire Bonding 20/Mar/2013 SOIC Pkg Wire Bonding Update 24/Jul/2013
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