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- TDA2HFBTQABCQ1
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TDA2HFBTQABCQ1 Технические параметры
Texas Instruments TDA2HFBTQABCQ1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | Texas Instruments | |
| Surface Mount | YES | |
| Number of Terminals | 760Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | FBGA, | |
| Date Of Intro | 2019-08-14 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Supply Voltage-Max | 1.2 V | |
| Supply Voltage-Min | 1.11 V | |
| Supply Voltage-Nom | 1.15 V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-609 Code | e1 | |
| Pbfree Code | Yes | |
| ECCN Code | 5A992.C | |
| Terminal Finish | TIN SILVER COPPER | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B760 | |
| Temperature Grade | AUTOMOTIVE | |
| uPs/uCs/Peripheral ICs Type | SoC | |
| Seated Height-Max | 2.96 mm | |
| Screening Level | AEC-Q100 | |
| Saturation Current | 3 | |
| Length | 23 mm | |
| Width | 23 mm |
TDA2HFBTQABCQ1 Документы
- Datasheetsd7b0c9f0f0af5058039413d89eb9f8b6.pdf
Индекс :
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