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TDA2SXBTQABCQ1 Технические параметры

Texas Instruments  TDA2SXBTQABCQ1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка Texas Instruments
Surface Mount YES
Contact plating gold-plated
Number of pins 31pins
Number of Terminals 760Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description FCBGA-760
Clock Frequency-Max 38.4 MHz
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Supply Voltage-Max 1.2 V
Supply Voltage-Min 1.11 V
Supply Voltage-Nom 1.15 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting THT
Connector pinout layout 1x31
Gross weight 2.95 g
Operating temperature -40...163°C
JESD-609 Code e1
Pbfree Code No
Свойство продукта Значение свойства
ECCN Code 3A991.A.2
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Current rating 1.5A
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B760
Temperature Grade AUTOMOTIVE
Speed 1176 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.96 mm
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
Screening Level AEC-Q100
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache NO
Rated voltage 60V
Profile beryllium copper
Saturation Current 3
Length 23 mm
Width 23 mm
Plating thickness 0.75µm
Flammability rating UL94V-0
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