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THS7327PHPRG4 Технические параметры
Texas Instruments THS7327PHPRG4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Linear - Amplifiers - Video Amps and Modules | |
| Марка | Texas Instruments | |
| Lifecycle Status | ACTIVE (Last Updated: 1 week ago) | |
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 48-PowerTQFP | |
| Number of Pins | 48Pins | |
| Weight | 134.490138mg | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e4 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 48Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Applications | Buffer | |
| Packing Method | TR | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Functions | 3Functions | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| Base Part Number | THS7327 | |
| Pin Count | 48 | |
| Output Type | Rail-to-Rail | |
| Temperature Grade | INDUSTRIAL | |
| Number of Circuits | 3Circuits | |
| Operating Supply Current | 118mA | |
| Nominal Supply Current | 100mA | |
| Output Current | 115mA | |
| Slew Rate | 1150V/μs | |
| Voltage - Supply, Single/Dual (±) | 2.7V~5.5V | |
| Output Current per Channel | 115mA | |
| Supply Type | Single | |
| Supply Voltage Limit-Max | 5.5V | |
| -3db Bandwidth | 500MHz | |
| Height | 1.2mm | |
| Length | 7mm | |
| Width | 7mm | |
| Thickness | 1mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
THS7327PHPRG4 Документы
- PCN Design/SpecificationCopper Bond Wire Revision A 04/Dec/2013
- PCN Assembly/OriginQualification Mold Compound 30/Sep/2014
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