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TC55YEM416BXGN70 Технические параметры

Toshiba America Electronic Components  TC55YEM416BXGN70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 48Terminals
Number of Words 1048576 wordsWord
Number of Words Code 1000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
Access Time-Max 85 ns
Package Description TFBGA, BGA48,6X8,30
Part Package Code BGA
Ihs Manufacturer TOSHIBA CORP
Part Life Cycle Code Obsolete
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Terminal Form BALL
Свойство продукта Значение свойства
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.2 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.65 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.012 mA
Organization 1MX16
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 16777216 bit
Parallel/Serial PARALLEL
I/O Type COMMON
Memory IC Type STANDARD SRAM
Standby Voltage-Min 1 V
Width 8 mm
Length 11 mm
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TC55YEM416BXGN70 Документы

TC55YEM416BXGN70 brand manufacturers: Toshiba America Electronic Components, Anli stock, TC55YEM416BXGN70 reference price.Toshiba America Electronic Components. TC55YEM416BXGN70 parameters, TC55YEM416BXGN70 Datasheet PDF and pin diagram description download.You can use the TC55YEM416BXGN70 Memory, DSP Datesheet PDF, find TC55YEM416BXGN70 pin diagram and circuit diagram and usage method of function,TC55YEM416BXGN70 electronics tutorials.You can download from the Anli.