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TC58C256AXB Технические параметры

Toshiba America Electronic Components  TC58C256AXB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
Surface Mount YES
Number of Terminals 69Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Package Description FBGA, BGA69,10X12,32
Access Time-Max 103 ns
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA69,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B69
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Supply Current-Max 0.045 mA
Organization 32MX8
Memory Width 8
Standby Current-Max 0.00004 A
Memory Density 268435456 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Data Polling NO
Toggle Bit NO
Command User Interface NO
Number of Sectors/Size 2K
Sector Size 16K
Page Size 512 words
Common Flash Interface YES
Просмотр сходства

TC58C256AXB Документы

TC58C256AXB brand manufacturers: Toshiba America Electronic Components, Anli stock, TC58C256AXB reference price.Toshiba America Electronic Components. TC58C256AXB parameters, TC58C256AXB Datasheet PDF and pin diagram description download.You can use the TC58C256AXB Memory - Modules, DSP Datesheet PDF, find TC58C256AXB pin diagram and circuit diagram and usage method of function,TC58C256AXB electronics tutorials.You can download from the Anli.