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THGBMJG7C2LBAB8 Технические параметры

Toshiba America Electronic Components  THGBMJG7C2LBAB8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
Surface Mount YES
Number of Terminals 153Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer TOSHIBA CORP
Package Description TFBGA-153
Date Of Intro 2019-04-18
Clock Frequency-Max (fCLK) 52 MHz
Number of Words 17179869184 wordsWord
Number of Words Code 16000000000Words Codes
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3.3 V
Type of connector pin strips
Connector socket
Kind of connector female
Spatial orientation straight
Contacts pitch 2.54mm
Electrical mounting SMT
Свойство продукта Значение свойства
Connector pinout layout 1x11
ECCN Code EAR99
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B153
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode SYNCHRONOUS
Organization 16GX8
Seated Height-Max 1.2 mm
Memory Width 8
Memory Density 137438953472 bit
Screening Level AEC-Q100
Parallel/Serial PARALLEL
Memory IC Type FLASH MODULE
Programming Voltage 3.3 V
Profile beryllium copper
Length 13 mm
Width 11.5 mm
Просмотр сходства
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