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TMPN3150B1AFG Технические параметры

Toshiba America Electronic Components  TMPN3150B1AFG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers - Application Specific
Марка
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code QFP
Package Description 14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64
Clock Frequency-Max 10 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Свойство продукта Значение свойства
Supply Voltage-Nom 5 V
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 64
JESD-30 Code S-PQFP-G64
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN
Seated Height-Max 3.15 mm
Address Bus Width 16
Boundary Scan NO
Low Power Mode YES
External Data Bus Width 8
Number of Serial I/Os 1Serial I/O
Length 14 mm
Width 14 mm
Просмотр сходства
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