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SDINBDG4-64G-I2 Технические параметры
Western Digital Corporation SDINBDG4-64G-I2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Western Digital Corporation | |
| Mounting Type | Through Hole, Right Angle | |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
| Shell Material, Finish | Steel, Nickel Plated | |
| Lead Free Status / RoHS Status | -- | |
| Voltage, Rating | 125V | |
| Contact Materials | -- | |
| Operating Temperature | -55°C ~ 105°C | |
| Series | AMPLIMITE HD-22 | |
| Packaging | Tray | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | -- | |
| Termination | Solder | |
| Connector Type | Receptacle, Female Sockets | |
| Number of Positions | 15Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | Black | |
| Number of Rows | 3Rows | |
| Contact Type | Signal | |
| Ingress Protection | -- | |
| Current Rating | 2A | |
| Contact Finish | Gold | |
| Wire Gauge | -- | |
| Flange Feature | Housing/Shell (4-40) | |
| Connector Style | D-Sub, High Density | |
| Contact Form | -- | |
| Shell Size, Connector Layout | 1 (DE, E) High Density | |
| Backset Spacing | 0.350 (8.89mm) | |
| Features | Board Lock | |
| Contact Finish Thickness | 15.0µin (0.38µm) | |
| Material Flammability Rating | -- |
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