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W25Q32FWXGAQ Технические параметры

Winbond  W25Q32FWXGAQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Winbond
Mounting Type Surface Mount
Package / Case 8-XDFN Exposed Pad
Supplier Device Package 8-XSON (4x4)
Voltage, Rating 150 V
Package Tube
Base Product Number W25Q32
Mfr Winbond Electronics
Product Status Obsolete
Memory Types Non-Volatile
Operating Temperature -40°C ~ 105°C (TA)
Series SpiFlash®
Tolerance 0.1 %
Temperature Coefficient 50 ppm/°C
Свойство продукта Значение свойства
Resistance 390 kΩ
Max Operating Temperature 155 °C
Min Operating Temperature -55 °C
Composition Thin Film
Power Rating 500 mW
Technology FLASH - NOR
Voltage - Supply 1.65V ~ 1.95V
Memory Size 32Mbit
Clock Frequency 104 MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Write Cycle Time - Word, Page 60µs, 5ms
Memory Organization 4M x 8
Height 650 µm
Просмотр сходства
W25Q32FWXGAQ brand manufacturers: Winbond, Anli stock, W25Q32FWXGAQ reference price.Winbond. W25Q32FWXGAQ parameters, W25Q32FWXGAQ Datasheet PDF and pin diagram description download.You can use the W25Q32FWXGAQ Memory, DSP Datesheet PDF, find W25Q32FWXGAQ pin diagram and circuit diagram and usage method of function,W25Q32FWXGAQ electronics tutorials.You can download from the Anli.