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W25Q64JVSFAM Технические параметры

Winbond  W25Q64JVSFAM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Winbond
Package / Case Axial
Mounting Type Surface Mount
Supplier Device Package Axial
Package Tube
Base Product Number W25Q64
Mfr Winbond Electronics
Product Status Active
Memory Types Non-Volatile
Operating Temperature -55°C ~ 155°C
Series Holco, Holsworthy
Packaging Bulk
Size / Dimension 0.098 Dia x 0.283 L (2.50mm x 7.20mm)
Tolerance ±0.1%
Part Status Active
Number of Terminations 2Terminations
Свойство продукта Значение свойства
Temperature Coefficient ±25ppm/°C
Resistance 523 Ohms
Composition Metal Film
Power (Watts) 0.25W, 1/4W
Technology FLASH - NOR
Voltage - Supply 2.7V ~ 3.6V
Failure Rate --
Memory Size 64Mbit
Clock Frequency 133 MHz
Access Time 6 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Write Cycle Time - Word, Page 3ms
Features Pulse Withstanding
Memory Organization 8M x 8
Height Seated (Max) --
Просмотр сходства
W25Q64JVSFAM brand manufacturers: Winbond, Anli stock, W25Q64JVSFAM reference price.Winbond. W25Q64JVSFAM parameters, W25Q64JVSFAM Datasheet PDF and pin diagram description download.You can use the W25Q64JVSFAM Memory, DSP Datesheet PDF, find W25Q64JVSFAM pin diagram and circuit diagram and usage method of function,W25Q64JVSFAM electronics tutorials.You can download from the Anli.