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W29N08GVBIAF Технические параметры
Winbond W29N08GVBIAF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Winbond | |
| Mounting Type | Panel Mount, Through Hole | |
| Surface Mount | YES | |
| Mounting Feature | Flange | |
| Shell Material | Aluminum | |
| Number of Terminals | 63Terminals | |
| Package | Retail Package | |
| Primary Material | Metal | |
| Mfr | Glenair | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Supply Voltage-Nom (Vsup) | 2.7V - 3.6V | |
| Package Description | VFBGA, | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Number of Words Code | 1000000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Operating Temperature-Max | 85 °C | |
| Manufacturer Part Number | W29N08GVBIAF | |
| Number of Words | 1073741824 wordsWord | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Winbond Electronics Corp | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 5.75 | |
| Operating Temperature | -65°C ~ 175°C | |
| Series | 806 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Solder | |
| Connector Type | Receptacle, Female Sockets | |
| Type | SLC NAND Flash | |
| Color | Silver | |
| Fastening Type | Threaded | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Orientation | C | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Shell Finish | Nickel/PTFE | |
| JESD-30 Code | R-PBGA-B63 | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Speed | 40MHz | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | |
| Seated Height-Max | 1 mm | |
| Memory Width | 8 | |
| Memory Density | 8Gb | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 3.3 V | |
| Temperature | 40ºC ~ 85ºC / -40ºC ~ 105ºC | |
| Width | 9 mm | |
| Length | 11 mm |
Индекс :
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