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- W29N08GWBIBA
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W29N08GWBIBA Технические параметры
Winbond W29N08GWBIBA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Winbond | |
| Mounting Type | Surface Mount | |
| Package / Case | 63-VFBGA | |
| Surface Mount | YES | |
| Supplier Device Package | 63-VFBGA (9x11) | |
| Number of Terminals | 63Terminals | |
| Package | Bulk | |
| Mfr | PEI-Genesis | |
| Product Status | Active | |
| Memory Types | Non-Volatile | |
| Supply Voltage-Nom (Vsup) | 1.7V - 1.95V | |
| Package Description | VFBGA, | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Number of Words Code | 512000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | W29N08GWBIBA | |
| Number of Words | 536870912 wordsWord | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Winbond Electronics Corp | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 5.75 | |
| Series | * | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Type | SLC NAND Flash |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Technology | FLASH - NAND (SLC) | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | R-PBGA-B63 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Memory Size | 8Gbit | |
| Speed | 40MHz | |
| Operating Mode | ASYNCHRONOUS | |
| Access Time | 25 ns | |
| Memory Format | FLASH | |
| Memory Interface | ONFI | |
| Organization | High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set | |
| Seated Height-Max | 1 mm | |
| Memory Width | 16 | |
| Write Cycle Time - Word, Page | 35ns, 700µs | |
| Memory Density | 8Gb | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 1.8 V | |
| Temperature | -40ºC ~ 85ºC / -40ºC ~ 105ºC | |
| Memory Organization | 512M x 16 | |
| Width | 9 mm | |
| Length | 11 mm |
Индекс :
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