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W29N08GWSIBA Технические параметры

Winbond  W29N08GWSIBA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Winbond
Surface Mount YES
Number of Terminals 48Terminals
Supply Voltage-Nom (Vsup) 1.7V - 1.95V
Package Description TSOP1,
Package Style SMALL OUTLINE, THIN PROFILE
Number of Words Code 512000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W29N08GWSIBA
Number of Words 536870912 wordsWord
Package Code TSOP1
Package Shape RECTANGULAR
Manufacturer Winbond Electronics Corp
Part Life Cycle Code Active
Samacsys Description 8G-BIT 1.8V
Ihs Manufacturer WINBOND ELECTRONICS CORP
Risk Rank 5.75
Type SLC NAND Flash
Свойство продукта Значение свойства
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
JESD-30 Code R-PDSO-G48
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Speed 40MHz
Operating Mode ASYNCHRONOUS
Organization High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 8Gb
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8 V
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Width 12 mm
Length 18.4 mm
Просмотр сходства
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