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W78L812A24DL Технические параметры

Winbond  W78L812A24DL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка Winbond
Surface Mount NO
Number of Terminals 40Terminals
Voltage, Rating 150 V
Package Style IN-LINE
Package Body Material PLASTIC/EPOXY
Package Equivalence Code DIP40,.6
Supply Voltage-Nom 4.5 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 2.4 V
Operating Temperature-Max 70 °C
Rohs Code Yes
Manufacturer Part Number W78L812A24DL
RAM(byte) 256
Clock Frequency-Max 20 MHz
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Nuvoton Technology Corp
ROM(word) 8192
Part Life Cycle Code Active
Number of I/O Lines 36I/O Lines
Ihs Manufacturer NUVOTON TECHNOLOGY CORP
Supply Voltage-Max 5.5 V
Risk Rank 5.58
Part Package Code DIP
Tolerance 0.25 %
JESD-609 Code e3
Pbfree Code Yes
Temperature Coefficient 50 ppm/°C
Resistance 47.5 kΩ
Свойство продукта Значение свойства
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 155 °C
Min Operating Temperature -55 °C
Composition Thin Film
Subcategory Microcontrollers
Power Rating 250 mW
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Pin Count 40
JESD-30 Code R-PDIP-T40
Qualification Status Not Qualified
Power Supplies 3/5 V
Temperature Grade COMMERCIAL
Speed 20 MHz
Supply Current-Max 20 mA
Bit Size 8
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Address Bus Width 16
CPU Family 8051
External Data Bus Width 8
ROM Programmability FLASH
Height 650 µm
Width 15.24 mm
Length 52.2 mm
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