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W967D6HBGX7I Технические параметры

Winbond  W967D6HBGX7I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Winbond
Surface Mount YES
Number of Terminals 54Terminals
Schedule B 8542320015
Supply Voltage-Nom (Vsup) 1.8V
Package Description VFBGA,
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Number of Words Code 8000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 70 ns
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W967D6HBGX7I
Number of Words 8388608 wordsWord
Package Code VFBGA
Package Shape RECTANGULAR
Manufacturer Winbond Electronics Corp
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Risk Rank 2.35
Свойство продукта Значение свойства
Type HyperRam
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B54
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Speed 200MHz
Operating Mode SYNCHRONOUS
Organization 16Mx8
Seated Height-Max 1 mm
Memory Width 16
Memory Density 128Mb
Parallel/Serial PARALLEL
Memory IC Type PSEUDO STATIC RAM
Temperature -40~85C/ Automotive
Width 6 mm
Length 8 mm
Просмотр сходства
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