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W971GG6JB-25 Технические параметры

Winbond  W971GG6JB-25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Winbond
Surface Mount YES
Number of Terminals 84Terminals
Package Description TFBGA, BGA84,9X15,32
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Number of Words Code 64000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA84,9X15,32
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 0.4 ns
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W971GG6JB-25
Clock Frequency-Max (fCLK) 400 MHz
Number of Words 67108864 wordsWord
Supply Voltage-Nom (Vsup) 1.8 V
Package Code TFBGA
Package Shape RECTANGULAR
Manufacturer Winbond Electronics Corp
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Risk Rank 8.15
Part Package Code BGA
Pbfree Code Yes
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.02
Subcategory DRAMs
Technology CMOS
Terminal Position BOTTOM
Свойство продукта Значение свойства
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Pin Count 84
JESD-30 Code R-PBGA-B84
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Power Supplies 1.8 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.225 mA
Organization 64MX16
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.01 A
Memory Density 1073741824 bit
I/O Type COMMON
Memory IC Type DDR DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Access Mode MULTI BANK PAGE BURST
Self Refresh YES
Width 8 mm
Length 12.5 mm
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