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W9812G2GH-6 Технические параметры
Winbond W9812G2GH-6 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | Winbond | |
| Mount | Surface Mount | |
| Surface Mount | YES | |
| Number of Pins | 86Pins | |
| Number of Terminals | 86Terminals | |
| RoHS | Compliant | |
| Package Description | TSOP2, TSSOP86,.46,20 | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Number of Words Code | 4000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | TSSOP86,.46,20 | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 5 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | W9812G2GH-6 | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| Number of Words | 4194304 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | TSOP2 | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Winbond Electronics Corp | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 5.7 | |
| Part Package Code | TSOP2 | |
| ECCN Code | EAR99 | |
| Max Operating Temperature | 70 °C | |
| Min Operating Temperature | 0 °C | |
| Additional Feature | AUTO/SELF REFRESH | |
| HTS Code | 8542.32.00.02 | |
| Subcategory | DRAMs | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.5 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 86 | |
| JESD-30 Code | R-PDSO-G86 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 3.3 V | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Power Supplies | 3.3 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 0.23 mA | |
| Data Bus Width | 32 b | |
| Organization | 4MX32 | |
| Output Characteristics | 3-STATE | |
| Seated Height-Max | 1.2 mm | |
| Memory Width | 32 | |
| Address Bus Width | 14 b | |
| Density | 128 Mb | |
| Standby Current-Max | 0.002 A | |
| Memory Density | 134217728 bit | |
| Max Frequency | 166 MHz | |
| I/O Type | COMMON | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Refresh Cycles | 4096 | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Interleaved Burst Length | 1,2,4,8 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Self Refresh | YES | |
| Width | 10.16 mm | |
| Length | 22.22 mm | |
| Radiation Hardening | No |
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