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W25N01GVTCIG TR Технические параметры

Winbond Electronics  W25N01GVTCIG TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Mounting Type Surface Mount
Package / Case 24-TBGA
Supplier Device Package 24-TFBGA (8x6)
Mfr Winbond Electronics
Package Tape & Reel (TR)
Product Status Active
Memory Types Non-Volatile
Base Product Number W25N01
Supply Voltage-Nom (Vsup) 2.7V - 3.6V
Moisture Sensitive Yes
Maximum Clock Frequency 104 MHz
Maximum Operating Temperature + 85 C
Supply Voltage-Max 3.6 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 2000
Active Read Current - Max 35 mA
Supply Voltage-Min 2.7 V
Mounting Styles SMD/SMT
Interface Type SPI
Manufacturer Winbond
Brand Winbond
Свойство продукта Значение свойства
Tradename SpiFlash
RoHS Details
Operating Temperature -40°C ~ 85°C (TA)
Packaging Reel
Type QspiNAND Flash
Subcategory Memory & Data Storage
Voltage - Supply 2.7V ~ 3.6V
Memory Size 1Gbit
Speed 104MHz
Clock Frequency 104 MHz
Supply Current-Max 35 mA
Access Time 7 ns
Memory Format FLASH
Memory Interface SPI - Quad I/O
Data Bus Width 8 bit
Organization High Quality Single Level Cell (SLC) Technology Standard Serial Interface with x1/x2/x4 Bus Width
Write Cycle Time - Word, Page 700μs
Product Type NAND Flash
Memory Density 1Gb
Product Category NAND Flash
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 128M x 8
Просмотр сходства
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