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- W25Q16FWBYIG
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W25Q16FWBYIG Технические параметры
Winbond Electronics W25Q16FWBYIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Mounting Type | Surface Mount | |
| Package / Case | 8-UFBGA, WLCSP | |
| Surface Mount | YES | |
| Memory Types | Non-Volatile | |
| Operating Temperature | -40°C~85°C TA | |
| Packaging | Tube | |
| Series | SpiFlash® | |
| Part Status | Last Time Buy | |
| Number of Terminations | 8Terminations | |
| Voltage - Supply | 1.65V~1.95V | |
| Terminal Position | BOTTOM | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 1.8V | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-30 Code | R-PBGA-B8 | |
| Supply Voltage-Max (Vsup) | 1.95V | |
| Supply Voltage-Min (Vsup) | 1.65V | |
| Memory Size | 16Mb 2M x 8 | |
| Operating Mode | SYNCHRONOUS | |
| Clock Frequency | 104MHz | |
| Memory Format | FLASH | |
| Memory Interface | SPI - Quad I/O, QPI | |
| Organization | 16MX1 | |
| Memory Width | 1 | |
| Write Cycle Time - Word, Page | 60μs, 3ms | |
| Memory Density | 16777216 bit | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 1.8V | |
| Length | 2.16mm | |
| Height Seated (Max) | 0.512mm | |
| Width | 1.56mm | |
| RoHS Status | Non-RoHS Compliant |
W25Q16FWBYIG Документы
- DatasheetsW25Q16FW
- PCN Obsolescence/ EOLW25Q16FW EOL 17/Jan/2020
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