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W25Q32JVSSIQ TR Технические параметры

Winbond Electronics  W25Q32JVSSIQ TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.209, 5.30mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Series SpiFlash®
Published 2014
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8Terminations
ECCN Code 3A991.B.1.A
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Voltage - Supply 2.7V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Свойство продукта Значение свойства
Supply Voltage 3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PDSO-G8
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Memory Size 32Mb 4M x 8
Operating Mode SYNCHRONOUS
Clock Frequency 133MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O
Organization 4MX8
Memory Width 8
Write Cycle Time - Word, Page 3ms
Memory Density 33554432 bit
Parallel/Serial SERIAL
Programming Voltage 3V
Alternate Memory Width 1
Length 5.28mm
Height Seated (Max) 2.16mm
Width 5.28mm
RoHS Status ROHS3 Compliant
Просмотр сходства

W25Q32JVSSIQ TR Документы

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