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W66BP6NBUAGJ Технические параметры
Winbond Electronics W66BP6NBUAGJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Mounting Type | Surface Mount | |
| Package / Case | 200-WFBGA | |
| Supplier Device Package | 200-WFBGA (10x14.5) | |
| Mfr | Winbond Electronics | |
| Package | Tray | |
| Product Status | Active | |
| Memory Types | Volatile | |
| Base Product Number | W66BP6 | |
| Moisture Sensitive | Yes | |
| Maximum Clock Frequency | 1.866 GHz | |
| Maximum Operating Temperature | + 105 C | |
| Supply Voltage-Max | 1.95 V | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 144 | |
| Supply Voltage-Min | 1.06 V | |
| Mounting Styles | SMD/SMT | |
| Manufacturer | Winbond |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Brand | Winbond | |
| RoHS | Details | |
| Series | - | |
| Operating Temperature | -40°C ~ 105°C (TC) | |
| Packaging | Tray | |
| Type | SDRAM - LPDDR4 | |
| Subcategory | Memory & Data Storage | |
| Voltage - Supply | 1.06V ~ 1.17V, 1.7V ~ 1.95V | |
| Memory Size | 2Gbit | |
| Clock Frequency | 1.866 GHz | |
| Access Time | 3.5 ns | |
| Memory Format | DRAM | |
| Memory Interface | LVSTL_11 | |
| Data Bus Width | 16 bit | |
| Organization | 128 M x 16 | |
| Write Cycle Time - Word, Page | 18ns | |
| Product Type | DRAM | |
| Product Category | DRAM | |
| Memory Organization | 128M x 16 |
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