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W66CP2NQUAFJ Технические параметры

Winbond Electronics  W66CP2NQUAFJ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Mounting Type Surface Mount
Package / Case 200-WFBGA
Supplier Device Package 200-WFBGA (10x14.5)
Mfr Winbond Electronics
Package Tray
Product Status Active
Memory Types Volatile
Base Product Number W66CP2
Moisture Sensitive Yes
Maximum Clock Frequency 1.6 GHz
Maximum Operating Temperature + 105 C
Supply Voltage-Max 1.95 V
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 144
Supply Voltage-Min 1.06 V
Mounting Styles SMD/SMT
Manufacturer Winbond
Свойство продукта Значение свойства
Brand Winbond
RoHS Details
Series -
Operating Temperature -40°C ~ 105°C (TC)
Packaging Tray
Type SDRAM - LPDDR4
Subcategory Memory & Data Storage
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Memory Size 4Gbit
Clock Frequency 2.133 GHz
Access Time 3.5 ns
Memory Format DRAM
Memory Interface LVSTL_11
Data Bus Width 32 bit
Organization 128 M x 32
Write Cycle Time - Word, Page -
Product Type DRAM
Product Category DRAM
Memory Organization 128M x 32
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