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W9725G6JB25I Технические параметры

Winbond Electronics  W9725G6JB25I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Mounting Type Surface Mount
Package / Case 84-TFBGA
Surface Mount YES
Memory Types Volatile
Operating Temperature -40°C~95°C TC
Packaging Tray
Published 2010
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 84Terminations
Terminal Finish MATTE TIN
Voltage - Supply 1.7V~1.9V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Свойство продукта Значение свойства
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B84
Qualification Status Not Qualified
Power Supplies 1.8V
Memory Size 256Mb 16M x 16
Clock Frequency 200MHz
Access Time 400ps
Memory Format DRAM
Memory Interface Parallel
Organization 16MX16
Output Characteristics 3-STATE
Memory Width 16
Write Cycle Time - Word, Page 15ns
Standby Current-Max 0.006A
Memory Density 268435456 bit
I/O Type COMMON
Refresh Cycles 8192
Sequential Burst Length 48
Interleaved Burst Length 48
RoHS Status ROHS3 Compliant

W9725G6JB25I Документы

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