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Winbond Electronics Corp PC97307-ICK/VUL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microcontroller, Microprocessor, FPGA Modules | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 16Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | QFP | |
| Package Description | QFP, | |
| Clock Frequency-Max | 48 MHz | |
| Moisture Sensitivity Levels | 2A | |
| Number of I/O Lines | 24I/O Lines | |
| Operating Temperature-Max | 70 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| JESD-609 Code | e0 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Terminal Finish | TIN LEAD | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | QUAD | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 220 | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 16 | |
| JESD-30 Code | S-PQFP-G16 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | COMMERCIAL | |
| Seated Height-Max | 4.1 mm | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| External Data Bus Width | 8 | |
| RAM (words) | 242 | |
| Bus Compatibility | PC-AT; EISA; ISA; PS/2; MICROCHANNEL | |
| Length | 28 mm | |
| Width | 28 mm |