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W25X05CLSVIG Технические параметры

Winbond Electronics Corp  W25X05CLSVIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
Surface Mount YES
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code SOIC
Package Description VSOP, TSOP8,.25
Clock Frequency-Max (fCLK) 104 MHz
Number of Words 65536 wordsWord
Number of Words Code 64000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code VSOP
Package Equivalence Code TSOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Свойство продукта Значение свойства
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Pin Count 8
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.3 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.012 mA
Organization 64KX8
Output Characteristics 3-STATE
Seated Height-Max 0.9 mm
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 524288 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Programming Voltage 3 V
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
Length 4.9 mm
Width 3.9 mm
Просмотр сходства
W25X05CLSVIG brand manufacturers: Winbond Electronics Corp, Anli stock, W25X05CLSVIG reference price.Winbond Electronics Corp. W25X05CLSVIG parameters, W25X05CLSVIG Datasheet PDF and pin diagram description download.You can use the W25X05CLSVIG Memory - Modules, DSP Datesheet PDF, find W25X05CLSVIG pin diagram and circuit diagram and usage method of function,W25X05CLSVIG electronics tutorials.You can download from the Anli.