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W632GU6KB12K Технические параметры

Winbond Electronics Corp  W632GU6KB12K technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount YES
Number of Terminals 96Terminals
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code BGA
Package Description 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96
Access Time-Max 0.225 ns
Clock Frequency-Max (fCLK) 800 MHz
Number of Words 134217728 wordsWord
Number of Words Code 128000000Words Codes
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.35 V
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.36
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Свойство продукта Значение свойства
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 96
JESD-30 Code R-PBGA-B96
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.45 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.283 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.38 mA
Organization 128MX16
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.019 A
Memory Density 2147483648 bit
I/O Type COMMON
Memory IC Type DDR3L DRAM
Refresh Cycles 8192
Sequential Burst Length 8
Interleaved Burst Length 8
Access Mode MULTI BANK PAGE BURST
Self Refresh YES
Length 13 mm
Width 9 mm
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W632GU6KB12K Документы

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