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Winbond Electronics Corporation W25N01GWTBIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Package / Case | TFBGA-24 | |
| Mounting Type | Surface Mount | |
| Surface Mount | YES | |
| Number of Terminals | 24Terminals | |
| RoHS | Details | |
| Mounting Styles | SMD/SMT | |
| Interface Type | SPI | |
| Supply Voltage-Min | 1.7 V | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 85 C | |
| Active Read Current - Max | 35 mA | |
| Maximum Clock Frequency | 104 MHz | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 480 | |
| Tradename | SpiFlash | |
| Schedule B | 8542320070, 8542320070/8542320070/8542320070/8542320070/8542320070 | |
| Programmable | Yes | |
| Dimensions | 8.1 x 6.1 x 0.85mm | |
| Minimum Operating Supply Voltage | 1.7 V | |
| Package Type | TFBGA | |
| Number of Words | 128MWord | |
| Maximum Operating Supply Voltage | 1.95 V | |
| Cell Type | SLC NAND | |
| Supply Voltage-Nom (Vsup) | 1.70V - 1.95V | |
| Supply Voltage-Max | 1.95 V | |
| Package Description | TBGA, | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Number of Words Code | 128000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | W25N01GWTBIG |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 8.5 | |
| Series | W25N01GW | |
| Type | QspiNAND Flash | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 24 | |
| JESD-30 Code | R-PBGA-B24 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Memory Size | 1 Gbit | |
| Speed | 104MHz | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 35 mA | |
| Data Bus Width | 8 bit | |
| Organization | 128 M x 8 | |
| Seated Height-Max | 1.2 mm | |
| Memory Width | 8 | |
| Memory Density | 1Gb | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH | |
| Programming Voltage | 1.8 V | |
| Temperature | -40ºC ~ 85ºC / -40ºC ~ 105ºC | |
| Width | 8.1mm | |
| Height | 0.85mm | |
| Length | 6.1mm |