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W25Q80NESNIG Технические параметры

Winbond Electronics Corporation  W25Q80NESNIG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация USB Flash Drives
Марка
EU RoHS Compliant
ECCN (US) EAR99
HTS 8542.32.00.71
Automotive No
PPAP No
Cell Type NOR
Chip Density (bit) 8M
Operating Current (mA) 20
Maximum Operating Supply Voltage (V) 1.3
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Supply Voltage (V) 1.14
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Maximum Programming Time (ms) 5/Page
Maximum Erase Time (S) 20/Chip
Max. Access Time (ns) 7
Timing Type Synchronous
Programmability Yes
Number of Words 1MWord
Number of Bits/Word (bit) 8Bits/Word (bit)s
Address Bus Width (bit) 24
Block Organization Symmetrical
Свойство продукта Значение свойства
Program Current (mA) 20
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 1.5(Max)
Package Width 4(Max)
Package Length 5(Max)
PCB changed 8
Supplier Package SOIC N
Lead Shape Gull-wing
Packaging Tube
Part Status Unconfirmed
Pin Count 8
Architecture Sectored
Sector Size 4Kbyte x 256
Page Size 256byte
Boot Block No
Просмотр сходства
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