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W29N01HVBINF TR Технические параметры

Winbond Electronics Corporation  W29N01HVBINF TR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Package / Case VFBGA-63
Mounting Type Surface Mount
Supplier Device Package 63-VFBGA (9x11)
RoHS Details
Mounting Styles SMD/SMT
Interface Type Parallel
Supply Voltage-Min 2.7 V
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C
Active Read Current - Max 35 mA
Moisture Sensitive Yes
Factory Pack QuantityFactory Pack Quantity 2500
Supply Voltage-Nom (Vsup) 2.7V - 3.6V
Supply Voltage-Max 3.6 V
Base Product Number W29N01
Mfr Winbond Electronics
Product Status Active
Свойство продукта Значение свойства
Memory Types Non-Volatile
Series W29N01HV
Packaging Reel
Operating Temperature -40°C ~ 85°C (TA)
Type SLC NAND Flash
Technology FLASH - NAND (SLC)
Voltage - Supply 2.7V ~ 3.6V
Memory Size 1 Gbit
Speed 40MHz
Supply Current-Max 35 mA
Access Time 20 ns
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 8 bit
Organization 128 M x 8
Write Cycle Time - Word, Page 25ns
Memory Density 1Gb
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 128M x 8
Просмотр сходства
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