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W29N08GVSIAA Технические параметры

Winbond Electronics Corporation  W29N08GVSIAA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация USB Flash Drives
Марка
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Surface Mount YES
Supplier Device Package 48-TSOP
Number of Terminals 48Terminals
EU RoHS Compliant
ECCN (US) 3A991b.1.a.
HTS 8542.32.00.71
Automotive Yes
PPAP Unknown
Cell Type SLC NAND
Chip Density (bit) 8G
Block Organization Symmetrical
Address Bus Width (bit) 31
Number of Bits/Word (bit) 8Bits/Word (bit)s
Number of Words 1GWord
Programmability Yes
Timing Type Asynchronous
Maximum Erase Time (S) 0.01/Block
Maximum Programming Time (ms) 0.7/Page
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 35
Program Current (mA) 35
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible No
ECC Support Yes
Support of Page Mode Yes
Minimum Endurance (Cycles) 100000
Mounting Surface Mount
Package Height 1
Package Width 18.4
Package Length 12
PCB changed 48
Standard Package Name SOP
Supplier Package TSOP-I
Lead Shape Gull-wing
Package Tray
Mfr Winbond Electronics
Product Status Active
Memory Types Non-Volatile
Supply Voltage-Nom (Vsup) 2.7V - 3.6V
Dimensions 18.5 x 12.1 x 1.05mm
Minimum Operating Supply Voltage 2.7 V
Package Type TSOP
Maximum Operating Temperature +85 °C
Minimum Operating Temperature -40 °C
Maximum Operating Supply Voltage 3.6 V
Свойство продукта Значение свойства
Package Description TSOP1,
Package Style SMALL OUTLINE, THIN PROFILE
Number of Words Code 1000000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number W29N08GVSIAA
Package Code TSOP1
Package Shape RECTANGULAR
Manufacturer Winbond Electronics Corp
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Risk Rank 2.28
Operating Temperature -40°C ~ 85°C (TA)
Series -
Part Status Active
Type SLC NAND Flash
Technology FLASH - NAND (SLC)
Voltage - Supply 2.7V ~ 3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Pin Count 48
JESD-30 Code R-PDSO-G48
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Memory Size 8Gbit
Speed 40MHz
Operating Mode ASYNCHRONOUS
Access Time 25 ns
Memory Format FLASH
Memory Interface Parallel
Architecture Sectored
Organization High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set
Seated Height-Max 1.2 mm
Memory Width 8
Write Cycle Time - Word, Page 25ns, 700µs
Memory Density 8Gb
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Sector Size 128Kbyte x 8192
Page Size 2Kbyte
Boot Block No
Temperature 40ºC ~ 85ºC / -40ºC ~ 105ºC
Memory Organization 1G x 8
Width 18.5mm
Height 1.05mm
Length 12.1mm
Просмотр сходства
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