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W632GU6MB12I/TRAY Технические параметры

Winbond Electronics Corporation  W632GU6MB12I/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
DRAM Type DDR3L SDRAM
Chip Density (bit) 2G
Number of Internal Banks 8Internal Banks
Number of Words per Bank 16M
Number of Bits/Word (bit) 16Bits/Word (bit)s
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 1600
Maximum Access Time (ns) 0.225
Address Bus Width (bit) 17
Minimum Operating Supply Voltage (V) 1.283
Typical Operating Supply Voltage (V) 1.35
Свойство продукта Значение свойства
Maximum Operating Supply Voltage (V) 1.45
Operating Current (mA) 210
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Industrial
Number of I/O Lines (bit) 16I/O Lines (bit)s
Mounting Surface Mount
Package Height 0.6(Max)
Package Width 7.5
Package Length 13
PCB changed 96
Standard Package Name BGA
Supplier Package VFBGA
Lead Shape Ball
Part Status Obsolete
Pin Count 96
Organization 128Mx16
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