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W971GG8SB-25 Технические параметры

Winbond Electronics Corporation  W971GG8SB-25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Package / Case TFBGA
Surface Mount YES
Memory Types DDR2 SDRAM, RAM
Number of Terminations 60Terminations
ECCN Code EAR99
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Additional Feature AUTO/SELF REFRESH
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Свойство продукта Значение свойства
JESD-30 Code R-PBGA-B60
Supply Voltage-Max (Vsup) 1.9V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7V
Interface Parallel
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 128MX8
Memory Width 8
Memory Density 1073741824 bit
Access Time (Max) 0.4 ns
Access Mode MULTI BANK PAGE BURST
Length 12.5mm
Height Seated (Max) 1.2mm
Width 8mm
RoHS Status RoHS Compliant
W971GG8SB-25 brand manufacturers: Winbond Electronics Corporation, Anli stock, W971GG8SB-25 reference price.Winbond Electronics Corporation. W971GG8SB-25 parameters, W971GG8SB-25 Datasheet PDF and pin diagram description download.You can use the W971GG8SB-25 Memory, DSP Datesheet PDF, find W971GG8SB-25 pin diagram and circuit diagram and usage method of function,W971GG8SB-25 electronics tutorials.You can download from the Anli.