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Winbond Electronics Corporation W9751G6KB25L technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 84Terminals | |
| EU RoHS | Compliant | |
| ECCN (US) | EAR99 | |
| HTS | 8542.32.00.28 | |
| Automotive | No | |
| PPAP | No | |
| DRAM Type | DDR2 SDRAM | |
| Chip Density (bit) | 512M | |
| Number of Internal Banks | 4Internal Banks | |
| Number of Words per Bank | 8M | |
| Number of Bits/Word (bit) | 16Bits/Word (bit)s | |
| Data Bus Width (bit) | 16 | |
| Maximum Clock Rate (MHz) | 800 | |
| Maximum Access Time (ns) | 0.4 | |
| Address Bus Width (bit) | 15 | |
| Interface Type | SSTL_18 | |
| Minimum Operating Supply Voltage (V) | 1.7 | |
| Typical Operating Supply Voltage (V) | 1.8 | |
| Maximum Operating Supply Voltage (V) | 1.9 | |
| Operating Current (mA) | 165 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Number of I/O Lines (bit) | 16I/O Lines (bit)s | |
| Mounting | Surface Mount | |
| Package Height | 0.8(Max) | |
| Package Width | 8 | |
| Package Length | 12.5 | |
| PCB changed | 84 | |
| Standard Package Name | BGA | |
| Supplier Package | WBGA | |
| Lead Shape | Ball | |
| Supply Voltage-Nom (Vsup) | 1.8V±0.1V | |
| Package Description | WBGA-84 | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Number of Words Code | 32000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Access Time-Max | 0.4 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | W9751G6KB25L | |
| Number of Words | 33554432 wordsWord | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Winbond Electronics Corp | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Risk Rank | 8.43 | |
| Part Status | NRND | |
| Type | DDR2 SDRAM | |
| Additional Feature | AUTO/SELF REFRESH | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 84 | |
| JESD-30 Code | R-PBGA-B84 | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Temperature Grade | OTHER | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Number of Ports | 1Port | |
| Speed | 333 / 400 / 533 MHz | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 32Mx16 | |
| Seated Height-Max | 1.2 mm | |
| Memory Width | 16 | |
| Memory Density | 512Mb | |
| Memory IC Type | DDR DRAM | |
| Access Mode | FOUR BANK PAGE BURST | |
| Self Refresh | YES | |
| Temperature | C-temp, I-temp/ Automotive | |
| Width | 8 mm | |
| Length | 12.5 mm |