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W988D6FBGX7E/TRAY Технические параметры

Winbond Electronics Corporation  W988D6FBGX7E/TRAY technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
EU RoHS Compliant
ECCN (US) EAR99
Automotive No
PPAP No
DRAM Type Mobile LPSDR SDRAM
Chip Density (bit) 256M
Number of Internal Banks 4Internal Banks
Number of Words per Bank 4M
Number of Bits/Word (bit) 16Bits/Word (bit)s
Data Bus Width (bit) 16
Maximum Clock Rate (MHz) 133
Maximum Access Time (ns) 8|5.4
Address Bus Width (bit) 15
Interface Type LVCMOS
Minimum Operating Supply Voltage (V) 1.7
Typical Operating Supply Voltage (V) 1.8
Maximum Operating Supply Voltage (V) 1.95
Operating Current (mA) 70
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Extended
Number of I/O Lines (bit) 16I/O Lines (bit)s
Свойство продукта Значение свойства
Mounting Surface Mount
Package Height 0.66
Package Width 8
Package Length 9
PCB changed 54
Standard Package Name BGA
Supplier Package VFBGA
Lead Shape Ball
Maximum Clock Rate 133(MHz)
Operating Temperature Classification Commercial
Package Type VFBGA
Operating Temp Range -25C to 85C
Address Bus 15(b)
Operating Supply Voltage (Max) 1.95(V)
Operating Supply Voltage (Typ) 1.8(V)
Rad Hardened No
Operating Supply Voltage (Min) 1.7(V)
Part Status LTB
Type MOBILE LPSDR SDRAM
Pin Count 54
Organization 16Mx16
Density 268435456(Bit)
Access Time (Max) 8/5.4(ns)
Supply Current 70(mA)
Просмотр сходства
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