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XCVC1902-2MSEVSVD1760 Технические параметры

Xilinx  XCVC1902-2MSEVSVD1760 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Xilinx
Package / Case 1760-BFBGA, FCBGA
Supplier Device Package 1760-FCBGA (40x40)
Maximum Operating Temperature + 200 C
Minimum Operating Temperature - 55 C
Factory Pack QuantityFactory Pack Quantity 1000
Mounting Styles PCB Mount
Part # Aliases B57540G0303F000
Manufacturer EPCOS / TDK
Brand EPCOS / TDK
RoHS Details
Number of I/Os 692I/Os
Package Tray
Mfr AMD Xilinx
Product Status Active
Series B57540G
Packaging Bulk
Operating Temperature 0°C ~ 100°C (TJ)
Tolerance 1 %
Свойство продукта Значение свойства
Type NTC
Resistance 30 kOhms
Subcategory Thermistors
Power Rating 18 mW
Termination Style Radial
Lead Diameter 0.15 mm
Speed 600MHz, 1.4GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Peripherals DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Product Type NTC Thermistors
Primary Attributes Versal™ AI Core FPGA, 1.9M Logic Cells
Flash Size -
Product Category NTC Thermistors
Width 0.8 mm
Height 1.4 mm
Diameter 0.8 mm
Просмотр сходства
XCVC1902-2MSEVSVD1760 brand manufacturers: Xilinx, Anli stock, XCVC1902-2MSEVSVD1760 reference price.Xilinx. XCVC1902-2MSEVSVD1760 parameters, XCVC1902-2MSEVSVD1760 Datasheet PDF and pin diagram description download.You can use the XCVC1902-2MSEVSVD1760 Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCVC1902-2MSEVSVD1760 pin diagram and circuit diagram and usage method of function,XCVC1902-2MSEVSVD1760 electronics tutorials.You can download from the Anli.