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XCVE2302-3HSESFVA784 Технические параметры

Xilinx  XCVE2302-3HSESFVA784 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Xilinx
Mount Surface Mount
Number of Pins 24Pins
RoHS Compliant
Maximum Operating Temperature + 100 C
Minimum Operating Temperature 0 C
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer Xilinx
Brand Xilinx
Packaging Tape and Reel
Termination SMD/SMT
Max Operating Temperature 85 °C
Min Operating Temperature -40 °C
Свойство продукта Значение свойства
Subcategory SOC - Systems on a Chip
Depth 15.88 mm
Operating Supply Voltage 880 mV
Inductance 1.5 mH
DC Resistance (DCR) 800 mΩ
Lead/Base Style Gull Wing
Product Type System-On-Modules - SOM
Isolation Voltage 1.5 kV
Product Category SoC FPGA
Turns Ratio 1:2.3
Width 12.19 mm
Height 5.84 mm
Length 17.78 mm
Просмотр сходства
XCVE2302-3HSESFVA784 brand manufacturers: Xilinx, Anli stock, XCVE2302-3HSESFVA784 reference price.Xilinx. XCVE2302-3HSESFVA784 parameters, XCVE2302-3HSESFVA784 Datasheet PDF and pin diagram description download.You can use the XCVE2302-3HSESFVA784 Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCVE2302-3HSESFVA784 pin diagram and circuit diagram and usage method of function,XCVE2302-3HSESFVA784 electronics tutorials.You can download from the Anli.