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Xilinx XCVM1302-2LSENBVB1024 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Xilinx | |
| Package / Case | 1024-BFBGA | |
| Supplier Device Package | 1024-BGA (31x31) | |
| Qualification | AEC-Q200 | |
| Maximum Operating Temperature | + 110 C | |
| Minimum Operating Temperature | 0 C | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | Xilinx | |
| Brand | Xilinx | |
| Number of I/Os | 316I/Os | |
| Package | Tray | |
| Mfr | AMD Xilinx | |
| Product Status | Active | |
| Operating Temperature | 0°C ~ 100°C (TJ) | |
| Series | Versal™ Prime | |
| Temperature Coefficient | 200 ppm/K | |
| Resistance | 51 kOhm |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Subcategory | SOC - Systems on a Chip | |
| Power Rating | 0.125 W | |
| Resistor Type | General Purpose | |
| Operating Supply Voltage | 700 mV | |
| Speed | 450MHz, 1.08GHz | |
| RAM Size | - | |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | |
| Peripherals | DDR, DMA, PCIe | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Product Type | System-On-Modules - SOM | |
| Resistance Tolerance | 5 | |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells | |
| Flash Size | - | |
| Product Category | SoC FPGA | |
| Product Length | 2 mm | |
| Product Width | 1.25 mm |