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XQZU55DR-L2FFRE1156I Технические параметры

Xilinx  XQZU55DR-L2FFRE1156I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Xilinx
Contact Plating Zinc
Body Orientation Straight
Termination Method Solder Lug
Wire Size 22 to 12, 22 AWG
Base/Housing Material Thermoplastic
Contact Materials Steel
Mounting Panel Mount
Свойство продукта Значение свойства
Factory Pack QuantityFactory Pack Quantity 1
Manufacturer Xilinx
Brand Xilinx
Operating Temperature -40 to 105 °C
Subcategory SOC - Systems on a Chip
Pitch 11.1000 mm
Housing Color Black
Product Category SoC FPGA
Product Length 24.89 mm
XQZU55DR-L2FFRE1156I brand manufacturers: Xilinx, Anli stock, XQZU55DR-L2FFRE1156I reference price.Xilinx. XQZU55DR-L2FFRE1156I parameters, XQZU55DR-L2FFRE1156I Datasheet PDF and pin diagram description download.You can use the XQZU55DR-L2FFRE1156I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XQZU55DR-L2FFRE1156I pin diagram and circuit diagram and usage method of function,XQZU55DR-L2FFRE1156I electronics tutorials.You can download from the Anli.