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Xilinx XQZU55DR-L2FFRE1156I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Xilinx | |
| Contact Plating | Zinc | |
| Body Orientation | Straight | |
| Termination Method | Solder Lug | |
| Wire Size | 22 to 12, 22 AWG | |
| Base/Housing Material | Thermoplastic | |
| Contact Materials | Steel | |
| Mounting | Panel Mount |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Manufacturer | Xilinx | |
| Brand | Xilinx | |
| Operating Temperature | -40 to 105 °C | |
| Subcategory | SOC - Systems on a Chip | |
| Pitch | 11.1000 mm | |
| Housing Color | Black | |
| Product Category | SoC FPGA | |
| Product Length | 24.89 mm |